WELCOME TO SISPAD2023
International Conference on Simulation of Semiconductor Processes and Devices
(SISPAD) provides an international forum for the presentation of leading-edge
research and development results in the area of process and device simulation.
SISPAD is one of the longest-running conferences devoted to technology
computer-aided design (TCAD) and advanced modeling of novel semiconductor devices
and nano electronic structures.
SISPAD2023 will be held in-person in Kobe, Japan, from September 27 to 29, 2023. A
satellite workshop will be offered on the day before the main conference starts
(Tuesday, September 26). Details on the SISPAD2023 technical program and workshop
will be announced here as soon as they are available.
We hope to see you in Kobe in September.
January 23, 2023
|Abstract submission site is now open|
|Abstract Submission Deadline is extended|
June 30, 2023
|Final Paper Submission Deadline|
July 31, 2023
|Early-bird Registration Deadline|
August 28, 2023
|Late Registration Deadline|
September 27, 2023
|SISPAD 2023 Start !|